september 2011 doc id 15195 rev 4 1/8 8 EMIF02-MIC06F3 2-line ipad? emi filter and esd protection features 2-line symmetrical low-pass filter lead-free package very low pcb space consuming: < 1.5 mm 2 very thin package: 0.65 mm high efficiency in esd suppression iec 61000-4-2 level 4 high reliability offered by monolithic integration high reduction of parasitic elements through integration and wafer level packaging complies with the following standards iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) application mobile phones (differential microphone filtering and esd protection) description the EMIF02-MIC06F3 is a highly integrated device designed to suppress emi/rfi noise for dual microphone line filtering. the EMIF02-MIC06F3 flip-chip packaging means the package size is equal to the die size. that's why EMIF02-MIC06F3 is a very small device. additionally, this filter includes an esd protection circuitry which prevents damage to the application when subjected to esd surges up to 15 kv. tm: ipad is a trademark of stmicroelectronics. figure 1. pin configuration (bump side) lead-free flip-chip package (8 bumps) b c 1 2 3 a mic bias eci op on n gnd a gnd mic2p mic2n www.st.com
characteristics EMIF02-MIC06F3 2/8 doc id 15195 rev 4 1 characteristics figure 2. configuration eci pin connection the eci pin (enhancement control interface) is an input pin for the audio pre-amplifier chip which detects the voltage of the microphone line mic2p in case the user presses the on- hook/off-hook button on the headset. when the user selects off-hook using the headset button, the mic2p is shorted to mic2n which is grounded. if your design does not support the eci feature, the eci pin must be left open (not connected). table 1. absolute ratings (limiting values) symbol parameter and test conditions value unit v pp pins b1 and c1: esd discharge iec 61000-4-2, level 4 air discharge contact discharge pins a2, a3, b2, b3, c2, c3: esd discharge iec 61000-4-2, level 1 air discharge contact discharge 15 8 2 2 kv p d power dissipation at t amb = 25 c 60 mw t j maximum junction temperature 125 c t op operating temperature range - 40 to + 85 c t stg storage temperature range - 55 to + 150 c gnd gnd gnd gnd gnd gnd gnd b1 c1 c3 b3 a3 a2 b2 and c2 are ground pins to asic c12 c11 c21 c22 r11 r21 r31 r22 r12 mic bias eci mic2p mic2n
EMIF02-MIC06F3 characteristics doc id 15195 rev 4 3/8 figure 3. electrical characteristics (definitions) symbol parameter v = breakdown voltage i = leakage current @ v r = series resistance between input and output c = line capacitance br rm rm i/o line i v v br v rm i r i rm i rm i r v rm v br table 2. electrical characteristics - values (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 14 v i rm v rm = 3 v per line 100 na r 11 1.922.1k r 12 0.811.2k r 21 , r 22 1.76 2.2 2.64 k r 31 20 25 30 c 11 , c 12 v r = 0 v 0.8 1 nf c 21 , c 22 v r = 0 v 1 1.25 nf figure 4. attenuation simulation with 1 k input and 10 k output figure 5. analog crosstalk measurement db 10 100 1k 10k 100k 1m 10m 100m 1g -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 50 simulations 50 measurements input: 1 k output: 10 k ac simulation f (hz) 100.0k 1.0m 10.0m 100.0m 1.0g -100.00 -90.00 -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 mic2p-on mic2n-op f (hz) db
characteristics EMIF02-MIC06F3 4/8 doc id 15195 rev 4 figure 10. line capacitance versus applied voltage figure 6. esd response to iec 61000-4-2 (+15 kv air discharge) on mic2p figure 7. esd response to iec 61000-4-2 (-15 kv air discharge) on mic2p 10 v/div 5 v/div 500 ns/div input output 10 v/div 5 v/div 500 ns/div input output figure 8. esd response to iec 61000-4-2 (+15 kv air discharge) on mic2n figure 9. esd response to iec 61000-4-2 (-15 kv air discharge) on mic2n 10 v/div 2 v/div 200 ns/div input output 10 v/div 2 v/div 200 ns/div input output 0.00 200.00 400.00 600.00 800.00 1 000.00 1 200.00 0 0.5 1 1.5 2 2.5 3 c line (pf) v line (v) f = 1 mhz v osc = 30 mv rms t j = 25 c
EMIF02-MIC06F3 ordering information scheme doc id 15195 rev 4 5/8 2 ordering information scheme figure 11. ordering information scheme 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 12. flip chip package dimensions emif yy - xxx zz fx emi filter number of lines information package x = resistance value (ohms) z = capacitance value / 10(pf) or 3 letters = application 2 digits = version f = flip chip x = 3: lead-free, pitch = 400 m 1.20 mm 30 m 1.20 mm 30 m 255 m 40 200 m 200 m 400 m 40 400 m 40 605 m 55
ordering information EMIF02-MIC06F3 6/8 doc id 15195 rev 4 figure 15. flip chip tape and reel specification 4 ordering information note: more information is availa ble in the application notes an2348: ?flip chip: package description and recommendations for use? an1751: ?emi filters: recommendations and measurements? figure 13. footprint recommendations figure 14. marking 220m recommended 220m recommended 260m maximum solder stencil opening : copper pad diameter: solder mask opening: 300m minimum x y x w z w dot, st logo ecopack status xx = marking yww = datecode (y = year z = manufacturing location dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.69 1.30 0.22 st st st xxz yww xxz yww xxz yww 1.30 st xxz yww table 3. ordering information order code marking package weight base qty delivery mode EMIF02-MIC06F3 jb flip chip 1.8 mg 5000 tape and reel 7?
EMIF02-MIC06F3 revision history doc id 15195 rev 4 7/8 5 revision history table 4. document revision history date revision changes 21-nov-2008 1 initial release 05-mar-2009 2 updated figure 4 and figure 12. 07-apr-2010 3 updated tolerance figure 12. 23-sep-2011 4 added eci pin connection on page 2 .
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